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June 2010

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Wed, 2 Jun 2010 18:24:11 -0400
Content-Type:
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Hi Genny,

I don't like guessing. It well could be overheating (as Dave said)
and it could be to an unacceptable degree, so your new joints won't
be reliable whatsoever. I had a case of reworked BGA, where it
received so much heat that Cu pads on the UBM got  dissolved in
solder leaving the balls hanging to the pads only around the
perimeter.

I ALWAYS recommend to do analysis, either prior to repair or after to
confirm the part/assembly is still reliable..

-- 
Best regards,

Vladimir                          mailto:[log in to unmask]

SENTEC  Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca


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