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June 2010

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From:
Ian Hanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ian Hanna <[log in to unmask]>
Date:
Fri, 18 Jun 2010 14:04:24 -0400
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This did not separate during thermals the edges are too smooth -- it was
fabbed that way.  Hard to tell if electrolytic or electroless voiding
from the condition on the section -- but if electrolytic would be caused
by debris and not a bubble as the tin overplate is also missing...a
little to even for an etch void and the shape looks a little 'flat' for
an air bubble...maybe a little bit of resist residue... 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chuck Brummer
Sent: Thursday, June 17, 2010 6:29 PM
To: [log in to unmask]
Subject: Re: [TN] Thursday Quiz

A ring void.  Maybe no electroless  but probably separated during a 
thermal excursion.  Has it been soldered?  If so the Z axis expansion
can 
cause this failure if not it was never plated.

Chuck Brummer
3M Manufacturing Engineer
8357 Canoga Ave.
Canoga Park, CA 91304-2605
(818) 734-4930




From:
Al Onderick <[log in to unmask]>
To:
[log in to unmask]
Date:
06/17/2010 02:04 PM
Subject:
[TN] Thursday Quiz
Sent by:
TechNet <[log in to unmask]>



What causes this ?

http://www.austinwoodsandwaters.com/open-via.jpg



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