I do not have a problem with that,
Werner

 


 

 

-----Original Message-----
From: vladimir Igoshev <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Jun 17, 2010 5:09 pm
Subject: Re: [TN] solder joint failures


Since Chris (or rather his company) and Werner are both independent consultant, 

I think Werner should get a commission :-)

Vladimir



SENTEC Testing Laboratory Inc.

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca



-----Original Message-----

From: Werner Engelmaier <[log in to unmask]>

Date:         Thu, 17 Jun 2010 16:52:19 

To: <[log in to unmask]>

Subject: Re: [TN] solder joint failures



 Hi Chris,

Pic 1: This is a creep-fatigue failure in a solder joint as the result of 

accelerated testing [see the coarsened grain band around crack].

Pic 2: This SJ was never properly made—it simply did not get hot enough to 

properly wet to the lead. Typically, the hottest part is the PCB and the 

component leads are connected to some heat sink and thus colder.

Pic 3: This looks like some inclusion, but from the little info this is not 

clear.

Werner



 





 



 



-----Original Message-----

From: Chris Mahanna <[log in to unmask]>

To: [log in to unmask]

Sent: Thu, Jun 17, 2010 12:57 pm

Subject: [TN] solder joint failures





So we’ve got a new toy, and now can image SJ failures a little differently.  



Requesting all experts to help me speak more intelligently about what we see.  



(until AJ-820 is published ☺)







These are of major interest to me today.  It’s the easy stuff.  It’s the weak 



link. It’s thru hole.  As always, I may or may not know the history.  As an 



independent lab, our customers don’t usually tell us much.  I suppose they’re 



fearful that we may just regurgitate.







http://ipc-technet.groupsite.com/gallery/13892







Chris







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