Chris,

I fully agree with Werner

Regards,
George
George M. Wenger
Senior Principal FMA  / Reliability Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, June 17, 2010 4:52 PM
To: [log in to unmask]
Subject: Re: [TN] solder joint failures

 Hi Chris,
Pic 1: This is a creep-fatigue failure in a solder joint as the result of accelerated testing [see the coarsened grain band around crack].
Pic 2: This SJ was never properly made—it simply did not get hot enough to properly wet to the lead. Typically, the hottest part is the PCB and the component leads are connected to some heat sink and thus colder.
Pic 3: This looks like some inclusion, but from the little info this is not clear.
Werner

 


 

 

-----Original Message-----
From: Chris Mahanna <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Jun 17, 2010 12:57 pm
Subject: [TN] solder joint failures


So we’ve got a new toy, and now can image SJ failures a little differently.  

Requesting all experts to help me speak more intelligently about what we see.  

(until AJ-820 is published ☺)



These are of major interest to me today.  It’s the easy stuff.  It’s the weak 

link. It’s thru hole.  As always, I may or may not know the history.  As an 

independent lab, our customers don’t usually tell us much.  I suppose they’re 

fearful that we may just regurgitate.



http://ipc-technet.groupsite.com/gallery/13892



Chris



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