Hi Ioan - If the reflow process renders the flux residue inert and you do 
not have flux residue on the connector contacts, is there some functional 
reason you don't like what we see in the photo? If the flux residues 
remaining after soldering have been correctly processed, there shouldn't 
be an issue unless you have a functional issue or an product use 
environment issue.

Dave Hillman
Rockwell Collins
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Ioan Tempea <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
06/17/2010 10:50 AM
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[TN] No-clean flux residue on connector






Dear Technos,

 

I have this issue with no-clean LF process 
http://ipc-technet.groupsite.com/gallery/13891

 

Will it pass IPC-610 class2?

 

We're not running much no-clean, so I don't really know if this issue is 
common with this process. Is there any way, other than masking the 
connectors, to keep the flux from ending on the body of this part? I can 
say we minimized the flux deposition, less than this and it will not 
solder.

 

Thanks, 

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]> 
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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