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June 2010

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Subject:
From:
"Roberts, Jon (SA-1)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roberts, Jon (SA-1)
Date:
Thu, 17 Jun 2010 09:30:43 -0500
Content-Type:
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Thanks to all of you who responded to my question and I forward some of
those to our reliability engineer and hardware QA investigation the
field failure.  They found your responses "very informative". Currently
we do not cover the holes with anything because the manufacture of the
BGA recommend we do not.  Should we have?  Thanks again, Jon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, June 16, 2010 5:14 PM
To: [log in to unmask]
Subject: Re: [TN] BGA AFTER 2 YEARS IN FIELD FAILED

Those lids are made with holes in them, this is to stop the lid being
forced
off during a reflow cycle by the air under the lid expanding and
breaking
the bond line.

The corrosion you are seeing is likely to be due to ingress of water
during
a water wash after reflow. The boards should be allowed to fully cool to
room temp before entering the wash as if they are at a temperature above
the
wash water the cooling effect of the wash water will cool down the bga
and
the air under the BGA lid and could lead to water ingress as a result.

Best regards,

John Burke

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon (SA-1)
Sent: Wednesday, June 16, 2010 12:26 PM
To: [log in to unmask]
Subject: [TN] BGA AFTER 2 YEARS IN FIELD FAILED

Has anyone experience a BGA failure after about 2 years, where under the
heat sink of the actual part (metal lid) corrosion has occurred.  The
lid does pop off, if you applied some pressure to examine, and what we
found was corrosion.  There appears to be two weep holes on the inside
of the part.  Unless you have seen it you are probably going to ask me
for some more information.  I will try and obtain any pictures as long
it as it does not show the manufacture.  Thanks, Jon


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