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June 2010

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Wed, 16 Jun 2010 22:54:04 +0200
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Thanks Wayne.
1.  No aspect on 'half moon crescent' ?

2.  Have you or  someone else practised Manson's universal slope equation 
for calculation of life expectancy of bond wires?

Delta epsilon = 3.5 x sigma b/E  x  Nf exp-0.12  +  epsilon1 exp 0.6 x Nf 
exp -0.6
where
Delta epsilon = elongation
sigma b = rupture tension
E = elasticity module
Nf = number of cycles to rupture
epsilon1= rupture elongation

We used this for deciding how many cycles gold wires would withstand in a 
typical MIL aircraft application when the substrates were alumina and the 
packages Kovar. The result was som 50,000 - 100,000 cycles or 60-120 years 
for -55/+125C.

The question is how much one can rely on this calculation model.  Anyone 
done similar ?  Personally I thing one should only see such calculations as 
estimations only.

Inge

--------------------------------------------------
From: "Thayer, Wayne - IIW" <[log in to unmask]>
Sent: den 16 June 2010 20:57
To: <[log in to unmask]>
Subject: Re: [TN] ?

> Hi Inge!
>
> 5 grams per square mil average shear for gold ball bonding
> Avg - 3 x StdDev > 3 grams for 1 mil gold destructive pull test
>
> The latter is kind of vague because the wire set must be large enough to 
> get a good sample size and all of the loops have to have reasonable 
> heights and must be similar.
>
> For aluminum, we're very application-dependent, but use the Avg - 3 x 
> StdDev as the parameter of interest.
>
> These don't test how close to cratering we are, which is an industry-wide 
> issue.
>
> Visually, we are looking for a consistent rim on the ball, and a rim 
> height no greater than about one half of the wire diameter.  For the 
> stitch, consistency and virtually no capillary imprint from the stitch 
> process on the lead/land.
>
> Wayne
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: Wednesday, June 16, 2010 1:58 PM
> To: [log in to unmask]
> Subject: [TN] ?
>
> What standards do you use for inspection and qualification of wire bonding
> today?
> Thanks
> IInge
>
>
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