Steve-

One more thing, although it is probably unimportant:

Your pix show the easiest to observe wire defect, the necking down.  But the mass of wire missing from the broken or necked down area had to go somewhere, or the distance between the leadframe components had to have increased permanently.

If the distance increased permanently, that would be possible if the fixture holding these LED components moved while the molding compound was above Tg.

In similar constructs, I have seen the extra wire at the top of the ball:  It sheared the wire off in the heat affected zone.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Sunday, June 13, 2010 12:22 PM
To: [log in to unmask]
Subject: Re: [TN] LED wiring bonding

Victor,

I have posted a few pictures on the IPC site -
http://ipc-technet.groupsite.com/galleries
I am probably way down at the bottom under "Mold Delamination from LED's and
Leadframes"


I had to crop them to hide the guilty, etc., but I believe they will still
get the point across

I've shown delamination of the mold compound from the lead frame and surface
of the LED as well as necking of the wire due to CTE issues.


Steve Creswick
http://www.linkedin.com/in/stevencreswick





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