Hello Technetters,

 

From time to time we all probably get asked if it OK to route non-common etch runs underneath components where the only "insulation" preventing etch shorting to the component body is soldermask.

 

I don't typically advise people to do this type of thing, although I know it is done in practice...usually as a last resort.

 

Is there any specification out there that either disallows the practice OR allows the practice with certain caveats?

 

Also, how do the product safety agencies view the practice?

 

Thanks in advance.

 

Gerry
 		 	   		  
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