Subject: | |
From: | |
Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Thu, 17 Jun 2010 20:25:11 -0500 |
Content-Type: | text/plain |
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Wendi,
I agree with your intent to check all including the 1-2-3 vias.
Nick
-----Original Message-----
From: Jose A Rios <[log in to unmask]>
To: (Combined Forum of D-33a and 7-31a Subcommittees) <[log in to unmask]>
Sent: 6/17/2010 7:06:50 PM
Subject: Re: [IPC-600-6012] Definition of "Via Structures"
hi wendi, i beleive it is not correct, and agree with your 'intent
bending' statement.
you'd be missing the plating integrity evaluation of the 1-2 / 2-3
interface and its registration.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
Wendi Boger <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
06/17/2010 06:30 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
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Subject
[IPC-600-6012] Definition of "Via Structures"
Need clarification on the definition of Via Structures as is relates to
Microsection Requirements.
3.6.1.5 Microsection Requirements
..... Evaluation of all applicable PTHs and vias, including
blind and buried, for all such structures found on the finished printed
board shall be inspected in the vertical cross section in accordance
with Table 4-3. ...
If a board has 1-2 lasers and 1-2-3 stacked lasers is it correct to
have 2 coupons one as 1-2 and one as 2-3. Both drill cycles and plating
cycles are represented but the 1-2-3 total via structure is not. Seems
like the 1-2 and 2-3 only is bending the intent.
Wendi
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