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Date: | Thu, 10 Jun 2010 14:22:05 -0400 |
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Hi Dee,
Yes it can be done, but only at SAC soldering temperatures. Having said this, this brings up the issue of whether the PCB and your components can take that temperature [multiple times] and the need for adequate moisture bake out.
You should have taken my seminar I just ave at SMT Nürnberg—I do give seminars at clients as well.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnectionand Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website:www.engelmaier.com
-----Original Message-----
From: Dee Stover <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Jun 10, 2010 10:12 am
Subject: [TN] rohs, BGAs & assembly
Hi all,
I need to find some written data on the long term reliability of rohs assemblies. We don't have comply with rohs but can only get the parts in rohs, with BGA's being the main drive for rohs compliant solder.
Just had an assembly vendor say that a rohs bga can be assembled with eutectic solder paste with good results. 2 other assembly shops say that is not recommended. Is there any real studies or data available that provides the real answer? Also studies and data for the reliability of rohs? We need our boxes to work for 10 years or more.
Thank you for your time. What a great network for people to share knowledge. I will also be going through PCD&F and google to (hopelessly behind on my reading)
:-) Dee Stover [log in to unmask] 520-318-8489
Tech Associate II
National Optical Astronomy Observatories
www.noao.edu
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