Sender: |
|
X-To: |
|
Date: |
Thu, 17 Jun 2010 11:33:04 -0500 |
Reply-To: |
|
Content-Transfer-Encoding: |
quoted-printable |
Subject: |
|
From: |
|
X-cc: |
|
In-Reply-To: |
|
Content-Type: |
text/plain; charset="ISO-8859-1" |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Hi Ioan - If the reflow process renders the flux residue inert and you do
not have flux residue on the connector contacts, is there some functional
reason you don't like what we see in the photo? If the flux residues
remaining after soldering have been correctly processed, there shouldn't
be an issue unless you have a functional issue or an product use
environment issue.
Dave Hillman
Rockwell Collins
[log in to unmask]
Ioan Tempea <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/17/2010 10:50 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Ioan Tempea <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] No-clean flux residue on connector
Dear Technos,
I have this issue with no-clean LF process
http://ipc-technet.groupsite.com/gallery/13891
Will it pass IPC-610 class2?
We're not running much no-clean, so I don't really know if this issue is
common with this process. Is there any way, other than masking the
connectors, to keep the flux from ending on the body of this part? I can
say we minimized the flux deposition, less than this and it will not
solder.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|