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May 2010

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Fri, 7 May 2010 07:01:21 -0400
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Juan,

Section 1.11 of J-STD-001D states 100% inspection is required unless sampling inspection is defined in a documented process control plan.

So as long as you document how you pick lots for solderability testing and work to that document, you are in compliance, even if it is less than 100% inspection.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Juan T. Marugán
Sent: Thursday, May 06, 2010 5:30 PM
To: [log in to unmask]
Subject: [TN] Question about solderability requirement (J-STD-001)

Hi all,

I have a question regarding the solderability requirement for tape & reel components (mainly chip components) in a tin-lead process. I know that you can help me.

J-STD-001 says that components to be soldered shall meet the solderability requirements of J-STD-002. Till now, we are not performing a solderability test at incoming for every lot of reels of components received. Fortunately, we do not have found significant problems due to this topic. Of course we do it when we want to check a specific lot of components.

Because pretinning is not an option, I'd like to know if not to do a solderability test of 100% of lots received is considered as a non-compliance of the J-STD-
001 requirements or it may be a risk.

Thank you so much for your comments,

Juan

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