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May 2010

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Subject:
From:
"Juan T. Marugán" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Juan T. Marugán
Date:
Thu, 6 May 2010 16:29:46 -0500
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Hi all,

I have a question regarding the solderability requirement for tape & reel 
components (mainly chip components) in a tin-lead process. I know that you 
can help me.

J-STD-001 says that components to be soldered shall meet the solderability 
requirements of J-STD-002. Till now, we are not performing a solderability test 
at incoming for every lot of reels of components received. Fortunately, we do 
not have found significant problems due to this topic. Of course we do it when 
we want to check a specific lot of components.

Because pretinning is not an option, I’d like to know if not to do a solderability 
test of 100% of lots received is considered as a non-compliance of the J-STD-
001 requirements or it may be a risk.

Thank you so much for your comments,

Juan

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