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May 2010

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Subject:
Re: Footprints?
From:
Inge <[log in to unmask]>
Reply To:
Inge <[log in to unmask]>
Date:
Thu, 6 May 2010 20:50:49 +0200
Content-Type:
text/plain
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text/plain (164 lines) 
Yeah...footloose and fancy-free...live on paddy, you'll be so thin that you 
need use padded jackets....
Dear Mr Punking, I've a feeling that we are a bit from the original 
question.
/Inge

--------------------------------------------------
From: "Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Sent: den 6 May 2010 19:22
To: <[log in to unmask]>
Subject: Re: [TN] Footprints?

> With the impact of Lead-free and the economy, a lot of us are moving to
> smaller pads.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> Sent: Thursday, May 06, 2010 9:51 AM
> To: [log in to unmask]
> Subject: Re: [TN] Footprints?
>
>
> Hi Iain,
> Mostly IPC 7351_A, however, for chip components and SAC solders i
> recommend much smaller pads.
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Braddock, Iain (UK) <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thu, May 6, 2010 11:04 am
> Subject: [TN] Footprints?
>
>
> Hi everyone,
>
> Just a quick straw pole. I am trying to gauge what this community are
> using to generate footprints.
>
> IPC 7351_A (superseding IPC 782)? Some other international standard,
> e.g. IEC 61188-5?, Bespoke footprints? A mixture of bespoke &
> international standards?
>
> Any feedback will be appreciated.
>
> CIA,
>    Iain.
>
>
>
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