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May 2010

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Thu, 6 May 2010 10:22:58 -0700
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With the impact of Lead-free and the economy, a lot of us are moving to
smaller pads.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, May 06, 2010 9:51 AM
To: [log in to unmask]
Subject: Re: [TN] Footprints?


 Hi Iain,
Mostly IPC 7351_A, however, for chip components and SAC solders i
recommend much smaller pads.
Werner

 


 

 

-----Original Message-----
From: Braddock, Iain (UK) <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, May 6, 2010 11:04 am
Subject: [TN] Footprints?


Hi everyone,
 
Just a quick straw pole. I am trying to gauge what this community are
using to generate footprints.
 
IPC 7351_A (superseding IPC 782)? Some other international standard,
e.g. IEC 61188-5?, Bespoke footprints? A mixture of bespoke &
international standards?
 
Any feedback will be appreciated.
 
CIA,
    Iain.
 
 

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