TECHNET Archives

May 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 3 May 2010 06:58:56 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (200 lines)
I would definitely like a copy.   By the way what is the LF wetting angle on a SJ and how to measure.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
Sent: Saturday, May 01, 2010 12:32 PM
To: [log in to unmask]
Subject: Re: [TN] Results of two survey questions

Hmmm. Wetting balance testing of 01005's - ROUND OBJECTS!

We have a new technical report recently finished on testing 0201's. This will result in changes to the International Standards that do not currently have any provision for either of these - so how someone could claim to have done it on 01005's is more then interesting, it is highly improbable.

If anyone would like a copy of our technical report please ask.

By the way, commercial or not, we make MUST wetting balance and I have responsibility for IEC Standards on solderability testing as well as working in this subject at IPC.

Regards

Graham Naisbitt - KBO

Email: [log in to unmask]
Phone: +44 (0)12 5252 1500
Web: www.gen3systems.com

On 1 May 2010, at 02:09, Bev Christian wrote:

> Technetters,
> 
> Here are the results of a couple of quick surveys that Bob Willis kindly
> carried out for me.  I find it interesting that 7 companies (or at least
> 7 people - all same company?  J  ) claim they can test 01005s on a
> wetting balance!  Comments?
> 
> 
> 
> The second one ties into my interest on wetting to OSP coated pads.
> 
> Bev
> 
> RIM
> 
> 
> 
> [log in to unmask]
> 
> 
> 
> 
> 
> 
> 
> How do you measure solderability on 01005 components? 
> 
> Use & hope for the best 
> 
> 13 
> 
> 
> 
> 44.8% 
> 
> 
> 
> 
> 
> Soldering to sample board 
> 
> 9 
> 
> 
> 
> 31% 
> 
> 
> 
> 
> 
> Wetting balance 
> 
> 7 
> 
> 
> 
> 24.1% 
> 
> 
> 
> 
> 
> Controlled dip & look 
> 
> 0 
> 
> 
> 
> 0% 
> 
> 
> 
> 
> 
> 
> 
> Number of Voters 
> 
> :  29 
> 
> 
> 
> Do you require positive wetting angles for joints regardless of metal or
> organic pad finish? 
> 
> Yes 
> 
> 15 
> 
> 
> 
> 75% 
> 
> 
> 
> 	 
> No 
> 
> 3 
> 
> 
> 
> 15% 
> 
> 
> 
> 	 
> Don't Know 
> 
> 2 
> 
> 
> 
> 10% 
> 
> 
> 
> 	 
> 
> 
> 
> 
> ---------------------------------------------------------------------
> This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.
> 
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or [log in to unmask] 
> ______________________________________________________________________
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2