TECHNET Archives

May 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ken Bloomquist <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Bloomquist <[log in to unmask]>
Date:
Wed, 5 May 2010 05:42:45 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (96 lines)
Thank you Inge, very intresting.

KennyB
-----Original Message-----
From: Inge [mailto:[log in to unmask]] 
Sent: Tuesday, May 04, 2010 3:27 PM
To: Ken Bloomquist; [log in to unmask]
Subject: Re: [TN] Why not Pb-free?

I send the paper to you, better read it yourself.  But it's "historical" 
from 2005

Inge

--------------------------------------------------
From: "Ken Bloomquist" <[log in to unmask]>
Sent: den 4 May 2010 22:54
To: <[log in to unmask]>
Subject: Re: [TN] Why not Pb-free?

> Inge,
>
> By your statement (maybe their statement) "... few solder joint 
> reliability
> problems when mixing SnPb and LF components and solder alloys."
>
> Doesn't that imply that that they are mixing lead into the solder joint in
> one way or another, "mixing SnPb and LF". I would think that any amount of
> lead added would help.
>
> KennyB
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: Tuesday, May 04, 2010 1:36 PM
> To: [log in to unmask]
> Subject: Re: [TN] Why not Pb-free?
>
> You reminded me of a report from NPL-2005.  In cooperation with Aeroflex,
> Alcatel, BAE, Bosch, Goodrich, RR, TRW and some more.  A very advanced
> investigation with lots of solders with Pb and without Pb. The titel was:
> Measuring the Reliability of Electronics Assemblies during the Transation
> Period to Lead free Soldering.  The foreword had this content:
> "The work has indicated that there should be few solder joint reliability
> problems  when mixing SnPb and LF components and solder alloys. Very few
> thermal cycling fatigue failures were experienced. Not one single failure
> was generated during the harsh vibration  testing ".
>
> I can't scan all these pages, however, if someone, not to many, are
> interested, I can send it offline.  You can probably get it from NPL
> directly yourself.
>
> Very optimistic result at that time.   Just wonder how they feel today.
> Anyone from NPL?
>
> Inge
>
>
>
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to 
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to 
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16

> for additional information, or contact Keach Sasamori at [log in to unmask] or

> 847-615-7100 ext.2815
> -----------------------------------------------------  


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2