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May 2010

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Tue, 4 May 2010 19:33:31 -0400
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Don

Back in the 90s several of us tested the texture of the soldermask is it related to solder balling. The clear result was that the textured soldermask had less tendency to solder ball.

Best regards
Lee
J. L. Parker Ph. D.
JLP Consultants LLC
804 779 3389   
  ----- Original Message ----- 
  From: Don McFarland<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Tuesday, May 04, 2010 4:19 PM
  Subject: [TN] Does solder mask specified create solder balls?


  Hi Technetters, 

  I was asked to perform a DOE to determine if there was a correlation
  between solder mask types and the rate at which we see solder balls
  develop on the PWB surface. I searched through the archives and found a
  few articles from the mid-90s about this topic, but couldn't glean
  anything exciting from the posts reviewed. I am wondering if anyone knows
  of a good source of information that addresses this topic or has anything
  that would be useful for us. 

  We have made a number of changes to other process variables (e.g. stencil
  apertures, solder pastes, paste viscosity, profiles, etc) and have seen
  good results, but we wanted to rule this out as a causal factor as well. 

  Any help is greatly appreciated!

  Don McFarland
    

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