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Date: | Tue, 4 May 2010 12:54:16 -0800 |
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Inge,
By your statement (maybe their statement) "... few solder joint reliability
problems when mixing SnPb and LF components and solder alloys."
Doesn't that imply that that they are mixing lead into the solder joint in
one way or another, "mixing SnPb and LF". I would think that any amount of
lead added would help.
KennyB
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, May 04, 2010 1:36 PM
To: [log in to unmask]
Subject: Re: [TN] Why not Pb-free?
You reminded me of a report from NPL-2005. In cooperation with Aeroflex,
Alcatel, BAE, Bosch, Goodrich, RR, TRW and some more. A very advanced
investigation with lots of solders with Pb and without Pb. The titel was:
Measuring the Reliability of Electronics Assemblies during the Transation
Period to Lead free Soldering. The foreword had this content:
"The work has indicated that there should be few solder joint reliability
problems when mixing SnPb and LF components and solder alloys. Very few
thermal cycling fatigue failures were experienced. Not one single failure
was generated during the harsh vibration testing ".
I can't scan all these pages, however, if someone, not to many, are
interested, I can send it offline. You can probably get it from NPL
directly yourself.
Very optimistic result at that time. Just wonder how they feel today.
Anyone from NPL?
Inge
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