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May 2010

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Subject:
From:
Ken Bloomquist <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Bloomquist <[log in to unmask]>
Date:
Tue, 4 May 2010 12:54:16 -0800
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text/plain
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text/plain (53 lines)
Inge,

By your statement (maybe their statement) "... few solder joint reliability
problems when mixing SnPb and LF components and solder alloys."

Doesn't that imply that that they are mixing lead into the solder joint in
one way or another, "mixing SnPb and LF". I would think that any amount of
lead added would help.

KennyB

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, May 04, 2010 1:36 PM
To: [log in to unmask]
Subject: Re: [TN] Why not Pb-free?

You reminded me of a report from NPL-2005.  In cooperation with Aeroflex, 
Alcatel, BAE, Bosch, Goodrich, RR, TRW and some more.  A very advanced 
investigation with lots of solders with Pb and without Pb. The titel was: 
Measuring the Reliability of Electronics Assemblies during the Transation 
Period to Lead free Soldering.  The foreword had this content:
"The work has indicated that there should be few solder joint reliability 
problems  when mixing SnPb and LF components and solder alloys. Very few 
thermal cycling fatigue failures were experienced. Not one single failure 
was generated during the harsh vibration  testing ".

I can't scan all these pages, however, if someone, not to many, are 
interested, I can send it offline.  You can probably get it from NPL 
directly yourself.

Very optimistic result at that time.   Just wonder how they feel today. 
Anyone from NPL?

Inge



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