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May 2010

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Subject:
Re: Does solder mask specified create solder balls?
From:
Inge <[log in to unmask]>
Reply To:
Inge <[log in to unmask]>
Date:
Tue, 4 May 2010 22:53:42 +0200
Content-Type:
text/plain
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text/plain (106 lines) 
....and fresh and tempered solder paste.  If too dry, some solder particles 
seem not to wet and they become repelled, of some reason. Don't know where 
the limit goes.  Think Mike F can tell us.
Inge

--------------------------------------------------
From: "Ioan Tempea" <[log in to unmask]>
Sent: den 4 May 2010 22:35
To: <[log in to unmask]>
Subject: Re: [TN] Does solder mask specified create solder balls?

> Don,
>
> I haven't met yet solderballing in SMT process that I could not eliminate 
> through proper stencil apertures (reduction, homeplating, etc.).
>
> Regards,
>
> Ioan Tempea, ing.
> Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
> T | 450.967.7100 ext.244
> E | [log in to unmask]
> W | www.digico.cc
>
> N'imprimer que si nécessaire - Print only if you must
>
>
> -----Message d'origine-----
> De : Don McFarland [mailto:[log in to unmask]]
> Envoyé : May-04-10 4:20 PM
> À : [log in to unmask]
> Objet : [TN] Does solder mask specified create solder balls?
>
> Hi Technetters,
>
> I was asked to perform a DOE to determine if there was a correlation
> between solder mask types and the rate at which we see solder balls
> develop on the PWB surface. I searched through the archives and found a
> few articles from the mid-90s about this topic, but couldn't glean
> anything exciting from the posts reviewed. I am wondering if anyone knows
> of a good source of information that addresses this topic or has anything
> that would be useful for us.
>
> We have made a number of changes to other process variables (e.g. stencil
> apertures, solder pastes, paste viscosity, profiles, etc) and have seen
> good results, but we wanted to rule this out as a causal factor as well.
>
> Any help is greatly appreciated!
>
> Don McFarland
>
>
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