Leland:
To your original question, we don't do sophisticated tracking of ambient exposure times, with RFID or otherwise.
Most of our parts are MSL 4 and above, just a few 5's. Our discipline is to keep parts in dry storage when they're not being worked on. And since our cycle times are pretty short, our analysis indicates that these practices are sufficient to ensure that we don't exceed floor life. If we find any parts not being stored properly, we bake them, but this is rare.
Our only failure in recent memory was with some parts that were characterized by the manufacturer as MSL 1, but were actually 3's.
-Joe
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Wednesday, May 26, 2010 3:43 PM
To: [log in to unmask]
Subject: Re: [TN] MSD Devices and Popcorning
No, I never electrically tested them. The parts I used had been dropped and had mangled leads.
I was just really shocked with the results of my experiment.
Leland
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, May 26, 2010 3:40 PM
To: [log in to unmask]
Subject: Re: [TN] MSD Devices and Popcorning
Was any electrical testing conducted?
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Wednesday, May 26, 2010 2:31 PM
To: [log in to unmask]
Subject: [TN] MSD Devices and Popcorning
Just on a note of curiosity, how many folks out there are using a sophisticated RFID process to track their MSD exposure times?
We're using a manual system, and lately I've had a couple of people inquiring about moving to something much more expensive. In my ten years here, we've never seen either an internal nor external failure due to popcorning, micro cracks in our devices, or anything along those lines.
A few years ago, I took 10 scrap ICs and soaked them in a glass of water over a four day weekend. When we returned on a Tuesday, I pulled them out, dried the surfaces off, and sent them through a lead free process reflow oven on a bare board.
After everything I'd read and investigated, I expected them to explode.
I performed an intense examination of both sides of the components under 100X magnification, and I was extremely surprised to see no incidents of popcorning nor package cracks. I then checked them in our X-ray machine, and saw no evidence of any bond wire detachments.
Has anyone conducted a similar experiment with dissimilar results?
I'm just wondering if we're making a mountain out of a mole hill here...
Thanks,
Leland
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