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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Thu, 27 May 2010 03:47:18 -0400
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Hi Leland,
Soaking in water is nowhere near as effective than exposure to high RH air for moisture absorption into PCBs and components.
Werner






-----Ursprüngliche Mitteilung----- 
Von: Leland Woodall <[log in to unmask]>
An: [log in to unmask]
Verschickt: Mi., 26. Mai. 2010, 21:31
Thema: [TN] MSD Devices and Popcorning


Just on a note of curiosity, how many folks out there are using a
ophisticated RFID process to track their MSD exposure times?
We're using a manual system, and lately I've had a couple of people
nquiring about moving to something much more expensive.  In my ten
ears here, we've never seen either an internal nor external failure due
o popcorning, micro cracks in our devices, or anything along those
ines.
A few years ago, I took 10 scrap ICs and soaked them in a glass of water
ver a four day weekend.  When we returned on a Tuesday, I pulled them
ut, dried the surfaces off, and sent them through a lead free process
eflow oven on a bare board.
After everything I'd read and investigated, I expected them to explode.
I performed an intense examination of both sides of the components under
00X magnification, and I was extremely surprised to see no incidents of
opcorning nor package cracks.  I then checked them in our X-ray
achine, and saw no evidence of any bond wire detachments.
Has anyone conducted a similar experiment with dissimilar results?
I'm just wondering if we're making a mountain out of a mole hill here...
Thanks,
Leland 
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