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May 2010

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 26 May 2010 14:39:50 -0500
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Was any electrical testing conducted?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Wednesday, May 26, 2010 2:31 PM
To: [log in to unmask]
Subject: [TN] MSD Devices and Popcorning

Just on a note of curiosity, how many folks out there are using a
sophisticated RFID process to track their MSD exposure times?

We're using a manual system, and lately I've had a couple of people
inquiring about moving to something much more expensive.  In my ten
years here, we've never seen either an internal nor external failure due
to popcorning, micro cracks in our devices, or anything along those
lines.

A few years ago, I took 10 scrap ICs and soaked them in a glass of water
over a four day weekend.  When we returned on a Tuesday, I pulled them
out, dried the surfaces off, and sent them through a lead free process
reflow oven on a bare board.

After everything I'd read and investigated, I expected them to explode.

I performed an intense examination of both sides of the components under
100X magnification, and I was extremely surprised to see no incidents of
popcorning nor package cracks.  I then checked them in our X-ray
machine, and saw no evidence of any bond wire detachments.

Has anyone conducted a similar experiment with dissimilar results?

I'm just wondering if we're making a mountain out of a mole hill here...

Thanks,

Leland 

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