Just reiterating what others have stated, Jon
ANSI/ESD S20.20-2007 references the two mil spec below:
MIL-STD-1686, "Electrostatic Discharge Control Program for Protection of
Electrical and
Electronic Parts, Assemblies and Equipment (Excluding Electrically
Initiated Explosive Devices)"
MIL-HDBK-263, "Electrostatic Discharge Control Handbook for Protection
of Electrical and
Electronic Parts, Assemblies, and Equipment (Excluding
Electrically-Initiated Explosive Devices)"
Both 1686 and 263 are active Mil Spec.
Mil HDBK 263B the references Mil Std 1695:
40.1.17 Relative humidity. Humid air helps to dissipate electrostatic
charges by keeping surfaces moist, therefore increasing surface
conductivity.
Substantial electrostatic voltage levels can accumulate with a decrease
in
relative humidity (see appendix A, table IV). However, it is also
evident
from table IV that significant electrostatic voltages can still be
generated
with relative humidity as high as 90 percent. Relative humidity between
40
percent and 60 percent in ESD protective areas is desirable as long as
it does
not result in corrosion or in other detrimental effects such as PWB
delamination during soldering. Where high relative humidity levels
cannot be
maintained, ionized air can be used to dissipate electrostatic charges.
MIL-STD-1695 specifically addresses relative humidity control in the
context
of static electricity protection. The MIL-STD-1695 requirement is for
relative humidity levels in the range of 30-70 percent in areas where
electronic parts and hybrid microcircuits (MIL-STD-1695, work areas 5
and 6)
are handled or processed. MIL-STD-1695 requires the same level of
relative
humidity controls for handling and storage areas (MIL-STD-1695, work
area 13),
except when items are covered or protected.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, May 04, 2010 9:17 AM
To: [log in to unmask]
Subject: [TN] Mil Specification for Facility Humidity Requirements
Hi folks - my brain cells need an assist. I am looking for the military
specification that calls out for a soldering facility to have a 30-60%
humidity requirement. I know the IPC JSTD-001E paragraph 4.2.2 values
but
also I remember a military specification also had the requirement but
can't seem to find the document.
TIA
Dave Hillman
Rockwell Collins
[log in to unmask]
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