Until now we have not considered going to Pb-free soldering processes for any 
of our products.  But in trying to keep up with the latest technologies it is 
becoming harder & harder to find Sn/Pb solder surface finishes, meaning we 
are spending huge amounts of resources reworking components prior to 
assembly.
Some management are wanting to convert the bulk of our products to Pb-free 
& are tiring of my usual arguments of - Tin whiskers, unknown reliability 
models, cost of running two separate processes, PWB development for higher 
reflow temps, review of current component database to verify compatibility 
with higher reflow temps, teaching old dogs new tricks.
Equipment is high end telecommunications mostly rack-mount office 
environment.
Questions – Are my arguments still valid?  Are there any recent studies 
concluded indicating Sn/Pb is superior?
Thank you in advance . . .

NOTE: This email is not the opinion or desires of the sender; it is solely the 
desires of the sender’s company.

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