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May 2010

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Subject:
From:
Angelo DiMichele <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Angelo DiMichele <[log in to unmask]>
Date:
Thu, 20 May 2010 08:10:30 -0500
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Bev,
      Thanks for the reply. We aren't try to fix the tombstoning with the reflow. 
We are still digging into the cause of those. The second reflow (At the correct 
profile) is to improve all solder joints.

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