I took your workshop at IPC MidWest called
"How to Specify PCBs to Reliably Survive the RoHS-Mandated Lead-Free
Soldering Processes"
which was VERY informative (you are a good teacher).
but
I would like to know if there are topics or data in the White Paper that
aren't in the workshop?
surfin' the learnin' curve,
Jack

.
On Wed, May 19, 2010 at 3:29 PM, Werner Engelmaier <[log in to unmask]>wrote:

>  Hi Jack,
> Thanks for the kudos.
> Let's first be precise with our language: there is RoHS-compliant and
> RoHS-capable—not the same ting at all.
> Also, there is 'dicy'-cured, phenolic-cured as well as
> non-dicy/non-phenolic-cured; the last is designed to fix some problems with
> phenolic-cure resins.
> Unfortunately, IPC-4101, even the C revision is not adequate for
> specification purposes—that is why I developed the White Paper.
> I fully agree with Dewey's testing recommendation.
> Werner
>
>
>
>  -----Original Message-----
> From: Jack Olson <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, May 18, 2010 5:28 pm
> Subject: [TN] My first RoHS circuit board!
>
> Well, we avoided it as long as we could, but now I have to design for RoHS
>
>
> compliance.
>
>
>
>
> I'm basically following Werner's recommendations (which don't conflict with
>
>
> anyone else's as far as I know), but I'm confused about one aspect of
>
>
> material:
>
>
> Several sources have stated that its better to use "NON-DICEY" material, but
>
>
> none of the IPC-4101 slash sheets mention dicy or non-dicy (or
>
>
> dicyandiamide).
>
>
> If we are trying /126 material, do we still have to specify non-dicy?
>
>
>
>
> thanks,
>
>
> Jack
>
>
>
>
>
>
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