Yes, two lead-free profiles plus selective solder for some through-hole
comps,
but expected to survive over twenty years in fairly harsh conditions, lots
of
thermal cycling (-45C+125C)
thanks for soothing my nerves...
by the way, our boards are shipped in sealed packages with humidity
indicators,
but then could be open on the floor for up to a day before being soldered.
Is one
day enough time to re-absorb enough moisture to cause a problem with /126?
thanks again,
Jack
On Tue, May 18, 2010 at 4:41 PM, Whittaker, Dewey (EHCOE) <
[log in to unmask]> wrote:
> Jack,
> Just designing for RoHS compliance does not dictate the use of non-dicey
> cured material. If you are designing a fully compliant, complex,
> Lead-free design that will be exposed to a minimum of two lead-free
> reflow profiles and one wave solder operation and expect it to work for
> twenty plus years, then no dicey-cured FR4 shall apply. IPC-4101/126 and
> /129 are phenolic cured materials which have demonstrated a robustness
> that is up to the challenge.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
> Sent: Tuesday, May 18, 2010 2:29 PM
> To: [log in to unmask]
> Subject: [TN] My first RoHS circuit board!
>
> Well, we avoided it as long as we could, but now I have to design for
> RoHS
> compliance.
>
> I'm basically following Werner's recommendations (which don't conflict
> with
> anyone else's as far as I know), but I'm confused about one aspect of
> material:
> Several sources have stated that its better to use "NON-DICEY" material,
> but
> none of the IPC-4101 slash sheets mention dicy or non-dicy (or
> dicyandiamide).
> If we are trying /126 material, do we still have to specify non-dicy?
>
> thanks,
> Jack
>
>
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