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May 2010

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 13 May 2010 08:48:08 -0500
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Hello Juan! The "rule" you are remembering is the old MIL-STD-2000 
specification requirement that stated if you used hot solder dipped 
components, you had a 2 year shelf life before being required to 
re-confirm component solderability. The current IPC JSTD 001E, paragraph 
4.4 requires that a manufacturer ensure that components are solderable and 
that the manufacturer should establish procedures to minimize 
solderability degradation. In a nut shell, the manufacturer needs to have 
a plan/process/protocol demonstrating that they have control of their 
component solderability.

Dave Hillman
Rockwell Collins
[log in to unmask]



"Juan T. Marugán" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
05/13/2010 08:41 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Juan T. Marugán" <[log in to unmask]>


To
[log in to unmask]
cc

Subject
[TN] Solderability maintenance (#3.9.2)






Is there anybody out there that remembers where is the "rule" to solder 
the components before 2 years (from their D/C, I suppose)?

This question is  referred to SMD -reeled- components.

Thank you.

Juan

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