Hi Cedric,
Lifted external lands result form land rotation during the soldering process high temperatures—manual soldering, especially of SAC solders, being particularly bad.
They are the external; signs of possible inner-layer separation as well as barrel cracks.
Werner

 


 

 

-----Original Message-----
From: Cedric ORAIN <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, May 11, 2010 5:22 pm
Subject: [TN] Pad lifting during manual soldering


Hello all, 

We've just achieved a critical process analysis on a PCBa for high end
market. We found that the land of some of the plated through hole appeared
slightly lifted from the PCB surface. 

The component was hand soldered with lead free alloy (SAC305).

Is pad lifting is acceptable? Or to what extend does it still acceptable?

I could post a picture, but I have to admit that I didn't know where or how?

Cedric ORAIN
Technical Director
www.inovelec-groupe.com



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