Hello all, 

We've just achieved a critical process analysis on a PCBa for high end
market. We found that the land of some of the plated through hole appeared
slightly lifted from the PCB surface. 

The component was hand soldered with lead free alloy (SAC305).

Is pad lifting is acceptable? Or to what extend does it still acceptable?

I could post a picture, but I have to admit that I didn't know where or how?

Cedric ORAIN
Technical Director
www.inovelec-groupe.com



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