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May 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Mon, 10 May 2010 20:14:16 -0400
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text/plain
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Check your vendor's recommendation about max heat and time.  You might damaged the device. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Chris Mahanna [mailto:[log in to unmask]]
Sent: Monday, May 10, 2010 05:48 PM
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] LED wiring bonding

It's all LEDs these days!

We have an FA that shows poor wire bonds to GaAlAs/GaAs in microsection after assembly.  The failure is seen in the parts per hundred across different lots and slightly different part numbers of LEDs.
The assumption would be that LED wiring bonding defects are very rare.   Is there something particular about these?  Or is it the crimping and/or Pb-free assembly that is pulling them apart?
The ones that seem more susceptible are GaAlAs  Double Heteros.

Thanks.

Chris


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