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May 2010

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
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Date:
Mon, 3 May 2010 23:21:14 +0000
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Bev,

I'd say one should distinguish between voiding in the bulk of solder and voiding at one of the two interfaces in a solder joints. I guess your question was about the former ones, as even 20% for the latter ones could be equivalent to a "disaster".

Regards,

Vladimir
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Bev Christian <[log in to unmask]>
Date:         Mon, 3 May 2010 15:47:36 
To: <[log in to unmask]>
Subject: [TN] Question about Voids in Solder Joints

TechNetters,
I was thinking about just putting "Voiding" as the e-mail title, but I
contemplated what I might get in responses and amended my title
accordingly.

My question is the following: do any of your companies have upper limits
on the amount of voiding in SMT solder joints of components that
customers have access to - like connectors and switches?  These of
course are leaded components.  I am not talking about Pb, but the form
of the interconnect between the component body and the board.

If so, are you willing and can you share?

Bev
RIM

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