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May 2010

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 3 May 2010 16:30:44 -0500
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Hi Bev - we have void in solder joint criteria for BGA/CSPs and for the 
thermal pad on BTC type devices  - no criteria for PTH or other SMT 
devices.

Dave Hillman
Rockwell Collins
[log in to unmask]



Bev Christian <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
05/03/2010 02:47 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Bev Christian <[log in to unmask]>


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Subject
[TN] Question about Voids in Solder Joints






TechNetters,
I was thinking about just putting "Voiding" as the e-mail title, but I
contemplated what I might get in responses and amended my title
accordingly.

My question is the following: do any of your companies have upper limits
on the amount of voiding in SMT solder joints of components that
customers have access to - like connectors and switches?  These of
course are leaded components.  I am not talking about Pb, but the form
of the interconnect between the component body and the board.

If so, are you willing and can you share?

Bev
RIM

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