We have to assemble TSOP packages on SSOP foot print PCB. (The TSOP
package width is 40 mils shorter than the SSOP package width).
We found that the theoretical ( calculated) side joint length (D) will be in some
instances less than the minimum acceptable side joint (as by IPC-A-610,
#8.2.5.4). (The available pad length on the PCB under the component lead is
less than the foot length).
It may be even worse if we have a slight solder defect, or if the component is
placed several mils off side.
What is the reliability impact?
Do you know about accelerated reliability tests or field data that show the
correlation between the failure rate and the side joint length?
Thankfully,
Mordechai Kirshenbaum
QA Team Manager
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