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Date: | Tue, 4 May 2010 16:41:24 -0700 |
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I concur. I was involved in testing in the 80s and 90s testing the
different solder mask finishes. Matte finishes clearly had less solder
balling. I believe (I am reaching back in the memory banks now) a
glossometer reading of less than 60 gave best results.
Regards,
Bob Metcalf
Western Regional Manager
Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA
Mobile: 714-334-7667
e-mail: [log in to unmask]
Internet: www.atotech.com
Managing Director: Kuldip Johal
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From: Lee parker <[log in to unmask]>
To: [log in to unmask]
Date: 05/04/2010 04:34 PM
Subject: Re: [TN] Does solder mask specified create solder balls?
Sent by: TechNet <[log in to unmask]>
Don
Back in the 90s several of us tested the texture of the soldermask is it
related to solder balling. The clear result was that the textured
soldermask had less tendency to solder ball.
Best regards
Lee
J. L. Parker Ph. D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: Don McFarland<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Tuesday, May 04, 2010 4:19 PM
Subject: [TN] Does solder mask specified create solder balls?
Hi Technetters,
I was asked to perform a DOE to determine if there was a correlation
between solder mask types and the rate at which we see solder balls
develop on the PWB surface. I searched through the archives and found a
few articles from the mid-90s about this topic, but couldn't glean
anything exciting from the posts reviewed. I am wondering if anyone
knows
of a good source of information that addresses this topic or has
anything
that would be useful for us.
We have made a number of changes to other process variables (e.g.
stencil
apertures, solder pastes, paste viscosity, profiles, etc) and have seen
good results, but we wanted to rule this out as a causal factor as well.
Any help is greatly appreciated!
Don McFarland
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