Subject: | |
From: | |
Reply To: | |
Date: | Tue, 4 May 2010 19:33:31 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Don
Back in the 90s several of us tested the texture of the soldermask is it related to solder balling. The clear result was that the textured soldermask had less tendency to solder ball.
Best regards
Lee
J. L. Parker Ph. D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: Don McFarland<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Tuesday, May 04, 2010 4:19 PM
Subject: [TN] Does solder mask specified create solder balls?
Hi Technetters,
I was asked to perform a DOE to determine if there was a correlation
between solder mask types and the rate at which we see solder balls
develop on the PWB surface. I searched through the archives and found a
few articles from the mid-90s about this topic, but couldn't glean
anything exciting from the posts reviewed. I am wondering if anyone knows
of a good source of information that addresses this topic or has anything
that would be useful for us.
We have made a number of changes to other process variables (e.g. stencil
apertures, solder pastes, paste viscosity, profiles, etc) and have seen
good results, but we wanted to rule this out as a causal factor as well.
Any help is greatly appreciated!
Don McFarland
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]>
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives<http://listserv.ipc.org/archives>
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16<http://www.ipc.org/contentpage.asp?Pageid=4.3.16> for additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or 847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|