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Date: | Thu, 13 May 2010 08:48:08 -0500 |
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Hello Juan! The "rule" you are remembering is the old MIL-STD-2000
specification requirement that stated if you used hot solder dipped
components, you had a 2 year shelf life before being required to
re-confirm component solderability. The current IPC JSTD 001E, paragraph
4.4 requires that a manufacturer ensure that components are solderable and
that the manufacturer should establish procedures to minimize
solderability degradation. In a nut shell, the manufacturer needs to have
a plan/process/protocol demonstrating that they have control of their
component solderability.
Dave Hillman
Rockwell Collins
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"Juan T. Marugán" <[log in to unmask]>
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05/13/2010 08:41 AM
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[TN] Solderability maintenance (#3.9.2)
Is there anybody out there that remembers where is the "rule" to solder
the components before 2 years (from their D/C, I suppose)?
This question is referred to SMD -reeled- components.
Thank you.
Juan
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