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David Bergman <[log in to unmask]>
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Thu, 27 May 2010 03:00:54 -0500
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[David Bergman] Forwarded for Werner Engelmaier….







Hi Leland,



Soaking in water is nowhere near as effective than exposure to high RH air for



moisture absorption into PCBs and components.



Werner



























-----Ursprüngliche Mitteilung-----



Von: Leland Woodall <[log in to unmask]<mailto:[log in to unmask]>>



An: [log in to unmask]<mailto:[log in to unmask]>



Verschickt: Mi., 26. Mai. 2010, 21:31



Thema: [TN] MSD Devices and Popcorning











Just on a note of curiosity, how many folks out there are using a



ophisticated RFID process to track their MSD exposure times?



We're using a manual system, and lately I've had a couple of people



nquiring about moving to something much more expensive.  In my ten



ears here, we've never seen either an internal nor external failure due



o popcorning, micro cracks in our devices, or anything along those



ines.



A few years ago, I took 10 scrap ICs and soaked them in a glass of water



ver a four day weekend.  When we returned on a Tuesday, I pulled them



ut, dried the surfaces off, and sent them through a lead free process



eflow oven on a bare board.



After everything I'd read and investigated, I expected them to explode.



I performed an intense examination of both sides of the components under



00X magnification, and I was extremely surprised to see no incidents of



opcorning nor package cracks.  I then checked them in our X-ray



achine, and saw no evidence of any bond wire detachments.



Has anyone conducted a similar experiment with dissimilar results?



I'm just wondering if we're making a mountain out of a mole hill here...



Thanks,



Leland



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