[David Bergman] Forwarded for Werner Engelmaier….
Hi Leland,
Soaking in water is nowhere near as effective than exposure to high RH air for
moisture absorption into PCBs and components.
Werner
-----Ursprüngliche Mitteilung-----
Von: Leland Woodall <[log in to unmask]<mailto:[log in to unmask]>>
An: [log in to unmask]<mailto:[log in to unmask]>
Verschickt: Mi., 26. Mai. 2010, 21:31
Thema: [TN] MSD Devices and Popcorning
Just on a note of curiosity, how many folks out there are using a
ophisticated RFID process to track their MSD exposure times?
We're using a manual system, and lately I've had a couple of people
nquiring about moving to something much more expensive. In my ten
ears here, we've never seen either an internal nor external failure due
o popcorning, micro cracks in our devices, or anything along those
ines.
A few years ago, I took 10 scrap ICs and soaked them in a glass of water
ver a four day weekend. When we returned on a Tuesday, I pulled them
ut, dried the surfaces off, and sent them through a lead free process
eflow oven on a bare board.
After everything I'd read and investigated, I expected them to explode.
I performed an intense examination of both sides of the components under
00X magnification, and I was extremely surprised to see no incidents of
opcorning nor package cracks. I then checked them in our X-ray
achine, and saw no evidence of any bond wire detachments.
Has anyone conducted a similar experiment with dissimilar results?
I'm just wondering if we're making a mountain out of a mole hill here...
Thanks,
Leland
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