Cedric,
There are 2 types of answers to your question: (1) legalistic, and (2) technical.
Which one is more important to you?
Werner
-----Original Message-----
From: Victor Hernandez <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, May 12, 2010 7:59 am
Subject: Re: [TN] Pad lifting during manual soldering
Target Condition − Class 1, 2, 3
• No lifting of lands.
Acceptable – Class 1, 2, 3
After thermal stress testing or rework simulation:
• Lifted lands are allowed.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Tuesday, May 11, 2010 4:32 PM
To: [log in to unmask]
Subject: Re: [TN] Pad lifting during manual soldering
Cedric:
IPC-A-610 handles that one. Class 1, 2 & 3 Defect if land is lifted away from
the PCB surface more than the thickness of the land. Process Indicator Class 1,
2 & 3 if land is lifted at all but less than the land thickness.
Gregg Owens
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cedric ORAIN
Sent: Tuesday, May 11, 2010 2:23 PM
To: [log in to unmask]
Subject: [TN] Pad lifting during manual soldering
Hello all,
We've just achieved a critical process analysis on a PCBa for high end
market. We found that the land of some of the plated through hole appeared
slightly lifted from the PCB surface.
The component was hand soldered with lead free alloy (SAC305).
Is pad lifting is acceptable? Or to what extend does it still acceptable?
I could post a picture, but I have to admit that I didn't know where or how?
Cedric ORAIN
Technical Director
www.inovelec-groupe.com
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