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| Date: | Wed, 14 Apr 2010 09:23:42 -0500 |
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Does anyone have a detailed solder creep graph (shear stress N/mm˛ vs.
time to rupture) for tin lead solder?
I have been using Figure 4.35 from Klein Wassink's Soldering in
Electronics. This graph starts at a shear stress of 1.
We have run a ProE computer model that shows a shear stress value of
0.6N/mm˛ on the connector pins of two boards that are mounted together. We
have placed some samples to bake at the maximum service condition
temperature to validate the computer model is realistic. It does not take
much of an extrapolation error on a small text book graph to be off by an
order of magnitude.
Roger Mack P.Eng.
Manufacturing Specialist
Parker Hannifin Electronic Controls
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB R3T 1T4 Canada
direct 204 453 3339 x373
[log in to unmask]
www.parker.com/ecd
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