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April 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 1 Apr 2010 09:42:09 -0400
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Iain, you might want go to the design forum ask about the tear drops.  Those guys got more tear than us based on my knowledge.  
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Apr 01 09:24:30 2010
Subject: Re: [TN] Tear drops?

Iain,

We are using Blind Via-in-pad on several designs.  We initially were not filling the vias and our EMS's had difficulty eliminating the voiding.  The voids ranged from minor voids at the blind via to void in the center ranging from 20-40% based on 5DX analysis.  So we went to copper filled vias.




Russell Nowland
Alcatel-Lucent
Advanced Manufacturing Engineer
Address: 14000 Quail Spring Parkway, Suite 300
Oklahoma City, OK 73134
email: [log in to unmask]
Desk: 405-302-1660
Cell: 405-203-0034
Fax: 405-302-1622
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)
Sent: Thursday, April 01, 2010 3:13 AM
To: [log in to unmask]
Subject: [TN] FW: Tear drops?

I guess from the lack of responses on this forum either you guy's are too busy or don't use them.

Perhaps a slightly shifted question:

Is anyone using µvia in pad for µBGA/CSP & are you filling the via's & with what?

Regards,
    Iain.

________________________________

From: Braddock, Iain (UK)
Sent: 30 March 2010 10:07
To: [log in to unmask]
Subject: Tear drops?


Hi everyone,

I'm interested in whether any of you feel there is a benefit of tear drop designed pads on your boards to improve x-ray inspection and whether you have implemented it and the associated difficulty tracking especially <0.8mm pitched devices?

Or perhaps you have implemented a design other than tear drop?

Any comments would be very much appreciated.

Regards,
    Iain.

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