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April 2010

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Subject:
Re: Reverse engineering proofing
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Fri, 9 Apr 2010 10:03:07 -0700
Content-Type:
text/plain
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text/plain (151 lines) 
If you're No Such Agency you just encapsulate a secondary with a Mg wire wired to a cap...

Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, April 09, 2010 3:30 AM
To: [log in to unmask]
Subject: Re: [TN] Reverse engineering proofing

 Put a Cyanide and a HF source on inside.  When you break the outer shell, 
the two parts will mix and generate a gas that noone wants to get into the 
lungs,  and the rest of the HF will destroy the chip in seconds.

Inge



--------------------------------------------------
From: "Kenneth Wood" <[log in to unmask]>
Sent: den 8 April 2010 14:31
To: <[log in to unmask]>
Subject: Re: [TN] Reverse engineering proofing

> Exploding dye packs inside the device should do it :)
> Ken
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
> Sent: Wednesday, April 07, 2010 2:55 PM
> To: [log in to unmask]
> Subject: [TN] Reverse engineering proofing
>
> Dear Technos,
>
>
>
> We want to prevent reverse engineering of a few products that we assemble,
> as much as we can. What are the proofing methods you use?
>
>
>
> An idea that came up was to cover the surface of the cards with potting. 
> If
> this makes sense, what substance to use?
>
>
>
> Thanks,
>
>
>
> Ioan Tempea, ing.
> Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
> T | 450.967.7100 ext.244
> E | [log in to unmask] <mailto:[log in to unmask]>
> W | www.digico.cc <http://www.digico.cc/>
>
>
> N'imprimer que si nécessaire - Print only if you must
>
>
>
>
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