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April 2010

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Subject:
From:
"Thayer, Wayne - IIW" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Thayer, Wayne - IIW
Date:
Wed, 7 Apr 2010 16:54:40 -0400
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Send all of the ICs to chip counterfeiters and have them re-label them with the wrong part numbers!

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, April 07, 2010 2:55 PM
To: [log in to unmask]
Subject: [TN] Reverse engineering proofing

Dear Technos,



We want to prevent reverse engineering of a few products that we assemble, as much as we can. What are the proofing methods you use?



An idea that came up was to cover the surface of the cards with potting. If this makes sense, what substance to use?



Thanks,



Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>


 N'imprimer que si nécessaire - Print only if you must




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