Along the same lines, a previous customer had a flex circuit that folded and
surrounded the secure assembly. The flex circuit was a matrix pattern of
traces and if any trace was cut the eprom would erase. The assembly was
potted inside the flex circuit and then that entire assembly was potted
inside a plastic housing. They also used a proprietary potting material
that was difficult to remove. I'm not sure how secure it was, but it sure
was a pain to assemble.
Good luck,
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roger Mack
Sent: Wednesday, April 07, 2010 3:29 PM
To: [log in to unmask]
Subject: Re: [TN] Reverse engineering proofing
We pot a lot of product. It is common practice to de-pot units for
analysis. It is not difficult. A little heat and an orange stick will
remove most.
I once worked on a contract to build secure terminals that had a wire loop
suspended in the potting that would erase the program if broken - maybe
better than nothing ,you would have to give me two of those to safely
de-pot it for you.
Potting would stop the curious, but not the really curious.
Also be careful of choosing something too hard to discourage removal, high
CTE mismatch between potting and board will cause failures during thermal
cycle. If it is a new process to you, make sure you qualify it.
Roger Mack P.Eng.
Manufacturing Specialist
Parker Hannifin Electronic Controls
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB R3T 1T4 Canada
direct 204 453 3339 x373
[log in to unmask]
www.parker.com/ecd
Ioan Tempea <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04-07-2010 13:54
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Ioan Tempea <[log in to unmask]>
To
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cc
Subject
[TN] Reverse engineering proofing
Dear Technos,
We want to prevent reverse engineering of a few products that we assemble,
as much as we can. What are the proofing methods you use?
An idea that came up was to cover the surface of the cards with potting.
If this makes sense, what substance to use?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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