We pot a lot of product. It is common practice to de-pot units for 
analysis. It is not difficult. A little heat and an orange stick will 
remove most. 
I once worked on a contract to build secure terminals that had a wire loop 
suspended in the potting that would erase the program if broken - maybe 
better than nothing ,you would have to give me two of those to safely 
de-pot it for you.
Potting would stop the curious, but not the really curious. 
Also be careful of choosing something too hard to discourage removal, high 
CTE mismatch between potting and board will cause failures during thermal 
cycle. If it is a new process to you, make sure you qualify it.


Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Electronic Controls
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x373
[log in to unmask]
www.parker.com/ecd







Ioan Tempea <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04-07-2010 13:54
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] Reverse engineering proofing






Dear Technos,

 

We want to prevent reverse engineering of a few products that we assemble, 
as much as we can. What are the proofing methods you use?

 

An idea that came up was to cover the surface of the cards with potting. 
If this makes sense, what substance to use?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]> 
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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