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April 2010

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 7 Apr 2010 14:54:56 -0400
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Dear Technos,

 

We want to prevent reverse engineering of a few products that we assemble, as much as we can. What are the proofing methods you use?

 

An idea that came up was to cover the surface of the cards with potting. If this makes sense, what substance to use?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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