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April 2010

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Wed, 7 Apr 2010 11:13:21 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (153 lines)
Pradeep:
Since you are getting Copper/Copper separation, you may want to look at rinsing, and particularly excessive rinsing before plating of the layer which separates.
We see excessive rinsing often, which causes tarnishing to occur, and if you are plating onto tarnish, your bond is severely compromised.
We recommend brief (20-30 second) rinses, without air agitation (other forms of agitation assist slightly).
Rudy Sedlak
RD Chemical Company

--- On Tue, 4/6/10, Pradeep Menon <[log in to unmask]> wrote:

From: Pradeep Menon <[log in to unmask]>
Subject: Re: [TN] Outer layer separation
To: [log in to unmask]
Date: Tuesday, April 6, 2010, 10:46 PM

Hi Werner,

We feel that the electroless copper is separating from the outer layer
copper . I have attached an image. Hope it helps.

rgds

Pradeep


>  Hi Pradeep,
> You do not give a sufficient description of the issue—what is separating
> from what?
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Pradeep Menon <[log in to unmask]>
> To: [log in to unmask]
> Sent: Fri, Apr 2, 2010 2:11 am
> Subject: [TN] Outer layer separation
>
>
> Dear all,
>
> Wanted some inputs on a problem which we are facing currently
>
> We observe a separation, rather tendency for separation, on 2.5mm thick
> MLB boards when subjected to 3X 288 deg 10 sec thermal stress. This is
> mostly found only on one side ie in one of the outerlayers, and very few
> on both outer layers. The inner layers are intact.
>
> We use N4000-6 as well as 4000-13EP laminates for fabricating PCBs and we
> use laminate construction for the stack up. We do Plasma desmear followed
> by a run thru permanganate too. We tried various parameters in drilling as
> well as reviewed all the basic electroless / electroplating parameters ,
> and all were found as desired.
>
> We use 1-1.2 microns thick electroless copper followed by a flash
> electrolplated copper of about 12 microns before pattern printing. The
> board is then pattern plated to achieve a minimum PTH copper of 30
> microns.
>
> Looking forward fro ur inputs
>
> Rgds
>
> Pradeep
>
>
>
>
>
>
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