Hi Werner,

We feel that the electroless copper is separating from the outer layer
copper . I have attached an image. Hope it helps.

rgds

Pradeep


>  Hi Pradeep,
> You do not give a sufficient description of the issue—what is separating
> from what?
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Pradeep Menon <[log in to unmask]>
> To: [log in to unmask]
> Sent: Fri, Apr 2, 2010 2:11 am
> Subject: [TN] Outer layer separation
>
>
> Dear all,
>
> Wanted some inputs on a problem which we are facing currently
>
> We observe a separation, rather tendency for separation, on 2.5mm thick
> MLB boards when subjected to 3X 288 deg 10 sec thermal stress. This is
> mostly found only on one side ie in one of the outerlayers, and very few
> on both outer layers. The inner layers are intact.
>
> We use N4000-6 as well as 4000-13EP laminates for fabricating PCBs and we
> use laminate construction for the stack up. We do Plasma desmear followed
> by a run thru permanganate too. We tried various parameters in drilling as
> well as reviewed all the basic electroless / electroplating parameters ,
> and all were found as desired.
>
> We use 1-1.2 microns thick electroless copper followed by a flash
> electrolplated copper of about 12 microns before pattern printing. The
> board is then pattern plated to achieve a minimum PTH copper of 30
> microns.
>
> Looking forward fro ur inputs
>
> Rgds
>
> Pradeep
>
>
>
>
>
>
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